The next frontier of brain-computer interfaces lies in devices. At the core of these devices are fundamental breakthroughs in materials and integration. The 2nd BCI Ecosystem Conference (iCCD2026) will be held at Royal Venus Hotel, Shenzhen, on October 28–29, 2026. Professor Song Enming, PhD supervisor at the Institute of Optoelectronics, Fudan University and Chief Scientist of Full-Brain Core Technology (Shanghai) Co., Ltd., will attend the conference and deliver a keynote speech titled Implantable Silicon-Based Neuromodulation Devices and Systems.
From Flexible Electrodes to Ten-Thousand Channels: A Technological Pathway of Fundamental Breakthroughs
Professor Song Enming has long been engaged in research on implantable flexible brain-computer interfaces, ultra-thin semiconductor devices and bioelectronic packaging technologies. He is a national high-level overseas talent and a recipient of MIT Technology Review’s Innovators Under 35 Asia Pacific award. His team has developed a flexible transfer technology for ultra-large-scale silicon-based thin-film materials, enabling the construction of full-brain-scale, ten-thousand-channel BCI amplifier microelectrode arrays. This opens up a new pathway for invasive BCIs to achieve high-density, high-signal-to-noise ratio, and long-term stable neural signal recording.
The core of this technical approach lies in fabricating silicon-based electronic devices thin and flexible enough to achieve seamless integration with brain tissue. In July 2026, Professor Song Enming’s team and collaborators published a study in Advanced Functional Materials, reporting a neural electrode array based on programmable laser lithography technology. It effectively addresses bottlenecks in conventional electrode fabrication, such as strong environmental dependence and poor structural consistency. Previously, the team developed microelectrode arrays with ultrahigh charge storage capacity using MXene materials. Their electrical performance is 10 to 100 times higher than that of traditional electrodes, and the arrays are compatible with MRI imaging.
From Lab to Industrialization: Full-Brain Core Technology’s Implementation Practice
Professor Song Enming also serves as Chief Scientist of Full-Brain Core Technology (Shanghai) Co., Ltd. Founded in 2026, Full-Brain Core Technology represents a landmark achievement as Ruining Bio extends its "Hydrogel Plus" platform strategy from materials science to the cutting-edge field of brain-computer interfaces. For China’s domestic BCI industry, the industrial advancement of flexible silicon-based CMOS technology is expected to break overseas technological monopolies in high-end implantable electrodes, and provide self-controllable underlying hardware solutions for homegrown implantable brain-computer interfaces.
In August 2026, Full-Brain Core Technology completed a multi-million-yuan angel round financing, led exclusively by Fudan University Innovation and Entrepreneurship Investment. Its technical roadmap was selected as a major BCI achievement at the 2026 Zhongguancun Forum. The company’s product portfolio covers three major scenarios: precise preoperative and intraoperative lesion localization, continuous monitoring of intracranial pressure and brain physiology, and augmented brain-computer interfaces.
Conference Highlight: The System-Level Breakthrough of Implantable Silicon-Based Devices
Implantable flexible electronic systems based on high-density integrated silicon-based CMOS technology have demonstrated enormous development potential. Research breakthroughs in this field are accelerating the rapid progress of biomedical engineering, with representative directions including implantable brain-computer interface (BCI) systems. In this context, Professor Song Enming's team takes ultra-large-scale multiplexed semiconductor functional thin-film device arrays as its starting point, with the main focus on a matrix sensing/imaging system for implantable EEG amplification microelectrode arrays.
At the iCCD2026 Conference, Professor Song Enming will systematically share the latest R&D progress of implantable silicon-based neuromodulation devices and systems. His keynote speech will focus on three core areas:
First, the device level: ultra-large-scale, ten-thousand-level silicon-based CMOS flexible transfer technology, enabling the construction of full-brain-scale, ten-thousand-channel BCI amplifier microelectrode arrays. It achieves a full-brain cortical microelectrode array with 32,000 CMOS channels and an efficiency of over 97%.
Second, the packaging level: packaging properties of thermally grown silicon dioxide nanomaterials on ultra-thin monocrystalline silicon, enabling sensor devices that can operate stably in animal models for several years (over 2 years in mice), with a theoretical operational stability exceeding 60 years.
Third, the sensing level: novel cortical imaging technology for electroencephalogram (EEG) sensing. It achieves a signal-to-noise ratio exceeding 50 dB and fidelity close to 100%, enabling an integrated implantable BCI system for EEG signal recording, stimulation and mapping imaging. This technology is expected to advance the applications of new multifunctional, high-performance biomedical engineering, and relevant findings carry important reference value for medical treatments of specific human diseases such as Parkinson’s disease and epilepsy.
When silicon-based electronics achieve seamless integration with brain tissue, and neural signals from ten-thousand channels can be captured and decoded simultaneously, brain-computer interfaces will truly possess a "neural highway" toward the next generation of human-machine interaction.
See you in Shenzhen, October 28–29, 2026.
