The medical device-specific laser cutting machine is tailored for the medical precision device industry, capable of processing holes or slit widths down to 30μm, achieving micron-level precision machining. The heat-affected area during processing is minimal, effectively avoiding material heating. The medical device-specific laser cutting machine is designed to address deformation and carbonization issues. The cutting surface is clean and neat, eliminating chipping defects and ensuring high product yield. The equipment features a user-friendly interface and is easy to operate, reducing personnel learning costs and facilitating rapid production line commissioning. It is widely compatible with various components of medical devices for drilling, slotting, and precision cutting processes. After numerous practical verifications in projects, it boasts a wealth of successful application cases, demonstrating mature and reliable technology that can be adapted for small-batch prototyping and large-scale automated production.
医疗器械专用激光切割机专为医疗精密器械行业打造，极限加工最小孔径或缝宽达30μm，实现微米级精细加工。加工过程热影响区域极小，有效避免材料热；医疗器械专用激光切机专为消变形、碳化问题；切割断面干净整齐，杜绝崩边缺陷，保障产品良率。 设备人机界面友好，操作简便，降低人员学习成本，便于产线快速投产。广泛适配医疗器械各类元器件的打孔、切缝、精密切割工艺，经过众多项目实际验证，具备丰富成功应用案例，工艺成熟可靠，可适配小批量打样与大批量自动化生产。